REPAKT Paper Division at PACK EXPO International 2026

REPAKT Paper Division is pleased to announce its participation in PACK EXPO International 2026, taking place October 18–21 in Chicago.

At booth N-5533, visitors will discover innovative technologies from the REPAKT Group, including solutions from both the Paper Division and the Polymer Division.

Featured Technologies

Weber Bundler
Designed to optimize end-of-line operations, the Weber Bundler delivers:

• Consistent and repeatable bundle quality
• Increased production efficiency and throughput
• Quick and simple changeovers
• Compact footprint
• Reliable operation and easy line integration

Karlville Swiss KS-SUP-ER
Representing the latest generation of pouch-making platforms, the KS-SUP-ER combines advanced servo-driven technology, high flexibility, fast changeovers, and smart automation to meet the evolving needs of the flexible packaging industry.

Discover the REPAKT Digital Application

Visitors will also be able to explore the new REPAKT Digital Application, an interactive platform featuring the complete Group portfolio. Users can browse all REPAKT technologies, access machine information, and interact with detailed 3D models of the equipment.

Meet Us in Chicago

📅 October 18–21, 2026
📍 Booth N-5533

Join the REPAKT Paper Division team at PACK EXPO 2026 to discover innovative solutions designed to improve productivity, flexibility, and efficiency across the packaging industry.

We look forward to welcoming you in Chicago!